SMP – technical data Electrical data Impedance Frequency range Contact resistance DWV Insulation resistance Corona levels RF high potential RF leakage Magnetic permeability VSWR Insertion loss Mechanical data Center contact retention Durability Force to engage Force to disengage Radial misalignment Axial misalignment Environmental data Temperature range Thermal shock Moisture resistance Corrosion Sine vibration Random vibration Shock Material data Cable and shroud connectors Body Contact Dielectric Ferrule Requirements 50 Ω DC to 40 GHz center conductor 6.0 milliohms max. outer conductor 2.0 milliohms max. 500 Vrms at sea level 5000 megaohms min. 190 Vrms at 70 000 ft 325 Vrms at 5 MHz 80 dB max. at 3 GHz 65 dB max. at 3 to 26.5 GHz < 2 Mu 1.2:1 to 18 GHz 1.35:1 to 26.5 GHz 1.5:1 to 40 GHz 0.06 √f in GHz (non-hermetic connectors) 0.12 √f in GHz (hermetic connectors) Requirements 1.5 lbs (6.672 N) min. (captivated designs) 100 cycles min. into a full detent shroud 500 cycles min. into a limited detent shroud 1000 cycles min. into a smooth bore shroud SMP full detent – 15 lbs (66.723 N) max. SMP limited detent – 10 lbs (44.482 N) max. SMP smooth bore – 2 lbs (8.896 N) max. SMP full detent – 5 lbs (22.241 N) min. SMP limited detent – 2 lbs (8.896 N) min. SMP smooth bore – 0.5 lbs (2.224 N) min. standard – ± 0.25 mm/0.010 in. min. float mount – ± 0.76 mm /0.030 in. min. standard – 0.25 mm/0.010 in. min. float mount – 1.27 mm/0.050 in. min. Requirements −65 to +165 °C MIL-STD-202, method 107, condition B MIL-STD-202, method 106 MIL-STD-202, method 101, condition B MIL-STD-202, method 204, 28 g peak MIL-STD-202, method 214, condition K-I, 46.3 g MIL-STD-202, method 213, 12 000 g peak Material beryllium copper per ASTM B- 196 or brass per QQ-B-626 #303 SS per ASTM A- 582 beryllium copper per ASTM B-196 PTFE per ASTM D-1710, type I, grade 1 or Tor- lonTM per ASTM D-5204 brass per ASTM B-135 Plating SUCOPRO gold plate passivated per SAE-AMS-2700 SUCOPRO god plate – SUCOPRO gold plate 94
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